Research of Control and Scheduling for Die-Bonding

Die-bonding is a necessary machine in semiconductor production line. In the thesis, the control and scheduling for the machine is focused on. Firstly, analyzing atypical task-scheduling algorithm in single-processor real-time system and introducing the work flow. Secondly, giving the software framework based on thread-pool for the control platform. Finally, discussing motion control module and triode-wafer detection module in detail.