On-wafer probing measurement and simulation modeling correlation of spiral inductors for integrative passive device application

Foundry process manufacture cost will increase with device size decrease from 28 nm to 22 nm. Wafer area will be focused on active device implementation. IC designer will want to implement passive device using package process not foundry process because cost concern. In this paper, we use Agilent ADS Momentum and EMpro to design and simulate spiral inductors and use our process capability to implement these inductors. From on-wafer probing measurement results, we can extract equivalent device model and relative parameters. This equivalent device model can be used in 2turns, 3turns...etc inductors. Finally, we will provide inductors' library for circuit designers during IC design stage. Designers can design circuits using foundry process to implement active devices and using packaging process to implement passive devices.