Power up your circuit design: Material suitable for system in package

In the recent years, tremendous signal communications are widely spreading on industrial and mobile markets. With the needs of greater freedom on design and reduction of volume size on electronic devices, functional of buried components with excellent signal integrity capability are more attracted. This paper illustrates a novel development on new resin system in an ultra-thin impregnate halogen-free based laminate. The key performances of this laminate are to provide designs with low leakage current, high K (DK>;15), ultra-thin thickness (30um), and low loss functionality (Df <;0.015). These advances of capabilities are tested by using high frequency analysis techniques and reliability verification that integrate a desired acknowledges from upstream to downstream fabricators to meet industry requirement to satisfy the designer's needs.