EMC analysis of PCB using ICEM model

This paper deals with the use of the integrated circuit electromagnetic model (ICEM) to analyze, predict, and optimize auto compatibility and electromagnetic emission at PCB level. ICEM is currently under standardization process (IEC62014-3). The basic ICEM architecture is composed of a power distribution network model and an internal current source modeling digital activity. Such an approach enables the description of any kind of digital or mixed-signal design. This model is useful either for the IC manufacturer or the system manufacturer. The power distribution network of a printed circuit board (PCB) can be optimized using this model by choosing the number and the right values of decoupling capacitors as well as the size of power planes. The IC manufacturer may check out the auto compatibility of an IC and determine the number of power pins as well as the package to be used.