Investigating the mechanical strength of Vapor Phase soldered chip components joints

In our experiment the mechanical strength of solder joints formed by Vapor Phase soldering was investigated. A testboard was designed, which allowed fifty pieces of 0603 size chip resistors to be placed. The soldering was carried out by infrared conventional reflow and by Vapor Phase reflow as well. After soldering the shear strength of joints formed by both of the soldering methods was measured, and the cross-section of solder joints was analyzed by Scanning Electron Microscopy. Based on the results, it can be said that the shear strength of joints formed by Vapor Phase soldering is slightly lower than the strength of joints formed by IR reflow. The thermal profile of Vapor Phase soldering needs further optimization. The detailed results are presented in the paper.