New silver contact pastes from high pressure sintering to low pressure sintering

Heraeus has developed a novel concept for silver sinter pastes. The new concept uses micro scale silver particles combined with sinter additives. The novel pastes have high sinter activity and a can be used in pressure free or less pressure bonding processes. The physical properties like shear strength at temperature above 200°C, electrical and thermal conductivity are outstanding compared to solder or silver adhesives. The new paste concept can reduce the pressure for the “Low Temperature Joining Technology” and is an alternative to nano-scaled silver pastes and can be potential lead free solutions for die attach applications. The paper describes the process route from high pressure to low pressure and limitations.