Temperature fields and reliability of thick-film components under pulse mode operation

This paper presents experimental studies on temperature fields distribution in thick-film and LTCC (Low Temperature Co-fired Ceramics) microcircuits with heat sources represented by resistors and their reliability under pulse loads. Thermographic scanning system based infrared detector was applied for thermal mapping of components and digital multimeter was used for carrying out ageing tests. Obtained results give practical information about possible applications of such components in microelectronic circuits and their reliability in different working conditions.