Nondestructive method of TIM bondline measurement in Flip Chips package

This paper describes the method of using Acoustic Micro Imaging (AMI) technique as nondestructive method to measure the bond line thickness (BLT) of the thermal interface material (TIM) in Flip Chips package; this is an alternative to destructive physical analysis. The purpose of this study is to demonstrate the capability of AMI used to measure the BLT of TIM. The two interfaces of interest are Lid-to-TIM, and TIM-to-Silicon chip.