Challenges & solutions in the die attach process for micro thin die

The drive for package thickness thinning and package size reduction has created new challenges for current wafer fabrication and assembly technology which has led to the smaller die and thinner wafer thickness trend. Thus, the conventional wafer thickness of 8 mils decreases to 4 mils is more challenging for the new innovation package of Micro Leadless Land Grid Array (µLLGA) with only 0.4mm package thickness.