Antenna miniaturization and integration in a 2.4 GHz system in package

In this paper, we present a novel technique to miniaturize an Inverted-F Antenna (IFA) by meandering its principal arm in three dimensions on several layers of a LTCC or a laminate FR4 substrate. Satisfactory performance like the coverage of the ISM band is achieved in a first batch of prototypes. Then, the improvement of the miniaturization technique, the integration of the new antenna in a full System in Package (SiP) and its measurement is demonstrated.