Fundamental study on heat transfer characteristics of microencapsulated phase change material suspensions flowing in circular mini-pipe

Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined in this paper. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3 μm was supplied into the mini-pipe having a diameter of 1 mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.