Performance Improvement in a 200 mm BiCMOS Technology by Si/SiGe Heterojuncton Bipolar Transistor Integration

This paper reports the integration of SiGe HBTs in a 200 mm, 0.5 μm BiCMOS process, as a first step towards an HBT-CMOS industrial technology. This was performed by suppressing the base implantation step and growing instead the emitter-base system selectively on the base active area, using an industrial Reduced-Pressure CVD cluster-tool. The so-fabricated HBTs show improved performance compared to the implanted base BJT of the support technology in terms of current gain, Early voltage and pinched base resistance. This improvement can be traded against higher collector doping and therefore higher operation frequency.