Performance comparison of MCM-D and SMT packaging technologies for a DSP subsystem

Advanced packaging technologies such as MCMs offer superior performance as compared to the conventional PCB technologies. This paper discusses the design, development, and comparison of a general purpose programmable DSP subsystem packaged in MCM and conventional surface-mount technologies. The subsystem contains a 32-bit floating-point programmable DSP processor along with 256 K-bytes of SRAM, 128 K-bytes of flash memory, a 10 K-gate FPGA, and a 6-channel 12-bit ADC. The complete subsystem has been interconnected on a 37 mm by 37 mm MCM-D substrate and is packaged in a 320-pin ceramic quad flatpack. This paper evaluates electrical and thermal performance for the MCM-D substrate and compares the results with the SMT version of the design.