A packaging system for built-in microcircuits in multilayer substrates

This paper presents an approach to the development of a packaging system for incorporating passive components such as resistors and capacitors within multilayer substrates. The electrical characteristics of the embedded passive components within the multilayer substrates are analyzed and evaluated by their mathematical models. A heuristic routing algorithm was proposed for the interconnections of the embedded passive components within the multilayer substrates. Experimental results were provided to show that the present proposed system has better performance than a commercial routing tool.