Warpage and stress characteristic analyses on wire-bond-S-FCCSP structure

For the trend of electronic consumer product, more functionalities, high performance, miniaturization, high reliability and low cost have been demanded intensely, especially in the rapid growth of portable cell phone domain. Furthermore, multiple functional demand induces advanced package developments, such as System-on-Chip (SoC) and System-in-Package (SiP). System-on-chip (SoC) is an ideal package to integrate multiple functionalities in the chip level. But the design and testing are not yet mature that, high cost and low manufacturing yield, drive multiple functional integration technology toward System-in-Package (SiP) development.