Modeling of Low Inductive Busbar Connections

The high power levels required by many power electronic applications—as well as the very low switching times encountered in new semiconductor devices—have created a need for low wiring inductances. The busbar technology is an effective industrial way to reduce the interconnection inductance between (for instance) the feeding source and the converter. It consists in a stacking of several copper sheets, each separated from the other by dielectric. The connections between these sheets and the different devices are made with screws. An example of structure will be presented below.