Copper Microstructure Impact on Evolution of Electromigration Induced Voids

We study the impact of microstructure on nucleation and evolution of electromigration induced voids. The grain boundaries are described with a comprehensive model which includes the dynamics of mobile and immobile vacancies in dependence of mechanical stress. The surface of an evolving void is modeled by a three-dimensional level-set algorithm. Simulations have shown that the constellation of grain boundaries determines the electromigration failure behavior seriously.