Interdisciplinary design optimization for high-speed packages and interconnects

With the trend towards finer feature size, increased density and higher signal speeds in designs, signal integrity and thermal management play significant roles towards system functionality and reliability. In practice, design optimizations for thermal performance and electrical performance are done in isolation of one another, usually resulting in a sub-optimal design. In the paper, a technique is proposed for placement of packages on a printed circuit board, using an interdisciplinary optimization formulation, taking into account the thermal and electrical performance as well as the manufacturability of the design.