Over-current turn-off failure in high voltage IGBT modules under clamped inductive load

Considering typical conditions of railway traction applications, this paper presents an experimental and simulative analysis of over-current turn-off failure in IGBT devices packaged in parallel within IGBT multichip modules. Extensive experimental analysis is carried out by means of a dedicated test-circuit. Thus, for greater insight, electro-thermal simulations at device level have been carried out. The results show that mismatches in the electro-thermal properties of the IGBT device during transient operation can lead to uneven power dissipation, significantly enhancing the risk of failure.