Power Distribution Fidelity of Wirebond Compared to FlipChip Devices in Grid Array Packages

We have simulated the power fidelity of wirebond and flip chip grid array packages suitable for next generation microprocessors. The DC power droop across the chip from resistive losses and the AC power noise from switching events were studied as a function of the number of package power planes, dielectric constant. the number of chip connections, decoupling capacitors and their location.