Introduction of a unified equipment platform for UV initiated processes in conjunction with the application of electrostatic carriers as thin wafer handling solution

This paper introduces the new MA8 Gen3 Aligner generation designed specifically for the development of 3D and MEMS packaging technologies. Photolithography on the wafer backside, wafer bonding and replication of microstructures are specific 3D / MEMS processes. They have in common that all of them require precision alignment and often will have to run on ultra-thin wafers. The MA8 Gen3 allows to run all the processes above on a unified equipment platform and therefore offers the ideal equipment solution for 3D and MEMS technologies. A second focus of this paper is at the applicability of electrostatic carriers as a thin wafer handling solution for the processes mentioned above. Electrostatic carriers are a straight forward and cost effective handling solution. They are not based on temporary adhesive wafer bonding and therefore do not require expensive adhesives or other consumables. The electrostatic carriers and the multi-functional Aligner platform combined result in a very cost effective manufacturing solution for 3D and MEMS packaging. The advantages of this solution will be discussed in more detail for the wafer-level manufacturing and assembly of camera modules and for Plasma Dicing.