Effect of bonding temperature and power setting on transducer velocity using principal components analysis in thermosonic bonding

In thermosonic wire bonding process, the bonding power setting and bonding temperature are important factors to the vibration of transducer system, which plays a crucial role in bonding formation. In a number of bonding experiments which were carried out at different power setting and temperature, vibration velocity at the tip of transducer was monitored. Vibration Signals were analyzed by wavelet decomposition and principal component analysis (PCA). The results show that principal component analysis is an effective method for vibration velocity analysis. The first principal component contains the most variability. And the component loadings on the major indexes are much larger than those on others, which can be neglected. These experimentally obtained data and results could conduce to further studying about the interaction of bonding parameters.