A procedure for accurate high-frequency characterisation of multi-pins backplane connectors

In this paper we present a procedure for the measurement of the high-frequency characteristics such as reflection, transmission and crosstalk of packages. Although the approach is valid for general packages, we apply it here to the specific case of multi-pins backplane connectors. The high accuracy of this procedure is needed to characterise the connectors over a wide bandwidth or a large range of rise times. Based on the measurements, equivalent models are derived that can be used in circuit design.