Layout-based 3D solid modeling for IC

A software system for 3D solid modeling of IC structures (devices, interconnection, and circuits) based on the layout design and processing information is described. Both the 3D perspective view and 2D cross sections of the structure can be examined using the system. Features of the system include automatic update of the geometry as the layout is changed and dynamic display of the process for constructing a structure layer by layer. Coupled with the process simulator and meshing tool, this modeling system can be used for device simulation. Further analysis of interconnection and circuit performance is made possible with other parameter extraction tools. The system configuration, its software components, and numerical techniques in processing mask data are discussed. The entire process of building an SRAM cell and generating an array of cells is demonstrated as an application example of the system.