High frequency characteristics of modular metric, high-density connector systems

A signal integrity analysis of modular metric high-density connector systems for use in telecommunication, computer- and other high-speed applications is presented. Carefully designed appropriate high performance test-setups-with different contact-pitch-consisting of backplane and daughtercard are the basis for all time- and frequency-domain measurements like TDR/TDT, crosstalk, insertion loss, VSWR, propagation delay etc. Based on 2-D FEM-calculations high-accurate simulation-models are produced which include multiline-crosstalk. The calculated curves are in an excellent agreement with the measured data. The behaviour in "bus-like" applications (connectors as a part of a stub) is discussed.