Enhanced Boiling Microstructures Applied to Microelectronics Cooling

A kind of Two-phase Closed Loop Thermosyphon (TCLT) which dissipate heat of electronic device was fabricated. The TCLT was composed of an evaporator, a condenser, a subcooler and connecting tubes. The most important part, the Enhanced Boiling Microstructures (EBMS) of evaporator, of the TCLT was studied. Three kinds of EBMS for nucleate boiling heat transfer were design. Pool boiling experiments were performed to estimate the performance of all kinds of microstructures. Then the best EBMS, which have the lowest wall superheat and highest Critical Heat Flux (CHF), was chosen as the part of a TCLT. Series dissipating heat experiments of the TCLT were carried on. Results show that thermal resistance of TCLT can reach minimum value 0.077°C/W when the highest heat flux that TCLT can transfer is 31.4W/cm².