New 3D integration technology and 3D system LSIs

A three-dimensional (3-D) integration technology based on the wafer-to-wafer bonding has been developed. Various kinds of 3-D LSI test chips such as 3-D microprocessor chip have been fabricated by using this technology. In addition, we have developed a new 3-D integration technology called super-chip integration based on the reconfigured wafer- to-wafer bonding in which the reconfigured wafers are produced by simultaneously aligning and bonding more than one thousand of known good dies (KGD's) on a supporting wafer using a self-assembly technique.