The integration of SWNTs with CMOS IC after covering Nickel/Gold on the Aluminum electrodes

This paper presents the interconnection of single-walled carbon nanotube (SWNT) between electrodes on a CMOS integrated circuit chip made by TSMC 0.35 mum CMOS process. Alternating current dielectrophoretic force (AC-DEP) method is employed to micro-electrode that makes SWNTs deposited between electrodes. Using electroless nickel and immersion gold to cover the electrodes of Al could really increase the current more than 3 orders when SWNTs are connected between electrodes.