Study of mounting fine pitch IC chips and passive components with Elasticity Bonding System

Elasticity Bonding System (EBS) is newly developed flip chip bonding method using thermosetting film-shaped resin as adhesive and elastic body as bonding tool. Unlike conventional Anisotropic Conductive Film (ACF) and Non Conductive Film (NCF) method, EBS can bond multi-chip, passive and IC chips simultaneously, because elastic body absorbs their difference in height and inclination.