Research on the Characteristic Test of Via Holes in Microwave Circuits

The detailed design and analysis for measuring characteristics of via holes in microwave circuits are presented, including the design of devices under test(DUT) and the test fixtures. Then the methodology of de-embedding based on TRL calibration is introduced which can help to extract the scattering parameters of via holes from the original measured data. The methodology including design, measurement and analysis will help the study of microstrip via holes.