Dielectric property of curing epoxy resin and application for casting processes

Epoxy casting resin is used in heavy apparatus as insulation and structural material. To optimize epoxy casting processes, several analytic techniques are used. Different from other techniques, dielectric analysis (DEA) has the advantage of nondestructive and on-line process measurement. We tried to evaluate the cure profile of bis-phenol A type liquid epoxy casting resin with DEA, DSC and a viscometer simultaneously, and found that the ionic conduction portions of the loss factor correlated well with glass transition temperature and viscosity.