Overview and Status of Numerical Electromagnetic Field Simulation Methods Applied to Integrated Circuits

We give a presentation on numerical electromagnetic field simulation methods applied to integrated circuits and discuss challenges of chip, package and board co- design. Different modeling techniques are introduced where especially the application and need for hybrid methods is stressed. Also the need for global methodologies in simulating digital and analog signal behavior of ICs is discussed and illustrated by real system-in-package (SiP) examples.