A 2D Time Domain Method for Electrical Analysis of Electronic Packages

This paper presents a two-dimensional full-wave method for efficient analysis of power integrity and electromagnetic interference (EMI) of high-speed electronic packages. The power/ground planes in electronic packages form a multilayered parallel-plate structure due to the practice of using whole metal plate as power or ground planes. Each pair of power/ground plane is suitable to be modeled by a 2D finite-different time domain (2D FDTD) method. Both the conductor loss and the substrate loss are also modeled by the 2D method. Besides the parallel-plate structure, electronic packages also comprise of many transmission lines including microstrip- and stripline-type structures. Those two types of structures are also resolved by the 2D method. A third type of structure in an electronic package is via, which is modeled by using a contour integral approach. So a unified solver may be developed in the context of 2D method for the signal and power integrity analysis of electronic packages. The electromagnetic interference (EMI) issue of electronic packages is also studied in this paper. The focus of it is the radiation due to the edge effect of the parallel-plate structure in a package. Numerical examples are given to demonstrate the method.