60GHz high speed wireless link - technology and design challenges

The recent success of millimeter wave integrated circuit designs in silicon has triggered a wave of interest and activity in a wide range of high speed wireless applications at 60 GHz. In this paper, we will review the latest developments in design and technology for 60 GHz multi-gigabit-per-second wireless communications. We will address the requirements and challenges for device performance, modeling and circuit design at millimeter wave frequencies, with a discussion of the advantages and disadvantages of SiGe BiCMOS and RFCMOS technology. Packaging, antenna design and integration will also be discussed.