InP photonic integrated circuits for optical communciations

This paper describes photonic integration circuits (PICs) realized on the InP platform including high-speed mode locked lasers, arrayed waveguide gratings (AWGs), differential Mach-Zehnder optical switches (MZI), and high-speed amplitude and phase modulators. Selected area hydride vapor phase epitaxy (HVPE) and organometallic chemical vapor deposition (OMCVD) were used to realized planarized and passivated integration including active and passive elements. The integrated chips of various configurations were investigated for dasiaoptical code division multiple access (O-CDMA)psila, in local area networks, and for dasiaoptical arbitrary waveform generation (OAWG),psila in high-speed optical communications.