Assembly of ultra-thin chip packages (UTCPs) for enhanced flexibility of flexible displays

In this paper, a setup has been designed to test the assembly of UTCPs onto patterned flexible substrates. The assembly is carried out with Anisotropic Conductive Film (ACF) bonding, offering the advantages of fine pitch connection possibilities and low-temperature curing, often a requirement for flexible display backplanes. Furthermore, the UTCP has been designed with contacts at the four sides of the (square) package, and a matching thermode allows for all four sides to be bonded at the same time.