Surface tension analysis affecting deformation of solder bumps

Fault deformation of IC die components is likely found during the manufacturing process due to the smaller size of components. Therefore, this study aims to use the analytical method for analysis of bump shape change in the symmetrical and asymmetrical pattern. In particular, the asymmetrical pattern is focused since it is commonly found in the production process of IC die package. Different bump alloy are analyzed. The results show that the model of bump shape change in the asymmetrical pattern is reasonable. Additionally, some parameters of IC die package production, such as temperature used for melting bump, height of bump and surface tension of bump materials, can be investigated. These instructions give you basic guidelines for preparing camera-ready papers for conference proceedings.