Evaluation of high density liquid crystal polymer based flex interconnect for supporting greater than 1 TB/s of memory bandwidth

An LCP flex based interconnect that significantly improves the interconnect density and supports data rates in the range of 10 to 16 Gbps is evaluated to enable future high bandwidth module based memory systems without requiring complex equalization techniques. A mating two-piece, low-profile, high density and small insertion force connector is developed for interfacing the flex to a flip-chip package. The 216 pin connector can support 72 differential pairs in a 6 × 12 array.