Comparison and analysis of integrated passive device technologies for wireless radio frequency module

We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of cost, size, performance & technology maturity, it comes out that silicon, glass & LTCC are the suitable technologies. We have designed IPDs using these technologies having same foot print to satisfy Intel Wi-MAX specs. Have taped out, validated the samples and made an electrical performance and cost comparison among three technologies. Result shows that Si_IPD & Glass_IPD both have well enough electrical performance required for Wi_MAX solution at lower cost and equivalent size compared to LTCC.