Wire bonding capillary profile and bonding process parameter optimization simulation

In this paper, a methodology for wire bonding parameter modeling is developed, which considers the capillary, FAB and device on silicon. The impact of capillary profile and bonding process parameters which include ball diameter, bonding temperature and bond wire material properties are studied to optimize the wire bonding assembly process. Finally, the comparison of the results with and without the modeling optimization shows that the probability of bonding failure is reduced after the wire bonding process is optimized.