Techniques for Early Package Closure in System-in-Packages

The two main forces pushing package technologies to a new frontier are size and cost. The need of the hour is miniaturization, fuelled by rapidly growing complexity in the wireless phone market. CSP(chip scale packaging) has already reached 100% and further miniaturization can be achieved only by 3D packaging techniques. Complex 3D packaging techniques having hit the roadmap, the SoC design is largely driven by the co-dice that are stacked and the package elements such as size, routing layers, ball count etc. wherein "package-die co-design" is extremely critical for on time product delivery. In fact, it is not surprising that a SoC's floorplan is driven by package and "co-design" is an understatement. This paper highlights the importance of package-die co- design for early package closure in SIPs. Guidelines and solutions on the Periphery and package planning are included. Careabouts and tradeoffs when designing SIPs are also explained.