Self-Assembly of Components using Shape-matching

This paper describes a process of mass self-assembly of micro-components onto a silicon substrate using mechanical shape-locking mechanism. Protrusions of certain pattern were electroplated onto 1 × 1 mm² micro-components. These protrusions served as a means for the micro-components to self-assemble onto the cavity receptor sites of the silicon substrate. The protrusions also served as an electrical interconnection between the micro-components and substrate. The self-assembly yield on an 8" wafer with ~1700 receptor sites is about 90% within 10 min. This parallel assembly technique demonstrates higher throughput for mass production, as compared to the conventional `pick and place' technique.