Warpage and Reliability of Three-dimensional Multi-chip Module with High Density Embedded Substrate

The warpage of three-dimensional multi-chip module (3D-MCM) was studied by using viscoplastic finite element (FE) and large strain theory. The results turned out that: it is the existence of the cavity in substrate that results in the double-bow warpage and the inflection point of warpage-versus-temperature curve of substrate; Cavity in the substrate center may decrease the warpage of substrate; Proper usage of underfilling material could strengthen interconnection of device and substrate and could decrease warpage of 3D-MCM, however, the too big CTE of underfilling material may incur other new failure models. Finally the moiré fringes measurement validated the simulation and warpage prediction of 3D-MCM.