Via-Free Interconnection in Quasi-Hermetic Wafer-Level Packaging for RF-MEMS Applications and 3D Integration

The development of an interconnection method based on electromagnetic coupling for hermetic or vacuum packaging in RF-MEMS applications is presented in this paper. Combined with wafer-level packaging by anodic bonding, it minimizes the leakage probability of such package by avoiding the use of vertical interconnections or horizontal feedthroughs. Electromagnetic simulations will be discussed and compared to microwave measurements on coupling structures.