Modularmultifunctional Siliconmicrosystems for Spacecraft Applications

This paper presents system engineering parameters obtained from experiments, design analyses, and modelling of multifunctional microsystem modules for future spacecraft, made from bonded silicon and glass wafers. Specifically, it is shown that the 68times68 mm, mass 54 g silicon modules in aluminium frames can be used as structural elements for spacecraft. Random vibration analysis implies that the modules can survive peak accelerations and shocks.