High Performance Microcooler Fabricated by Multiple Stacking of Electroplated Metal Patterns

We present a high performance microcooler fabricated by multiple-stacking of electroplated metal patterns using surface-activated bonding (SAB). We demonstrated the potential of a microchannel liquid cooler for a high-power electronic device, which is 10 mm square and 0.6 mm high and consists of 800 microchannels in 10 stories of the structure by stacking 20 layers of 30 μm-thick electroplated nickel patterns. We experimentally showed that the cooling capacity was 85 W with only a hydraulic pressure drop of 0.1 MPa.