Dynamic Crack Propagation Prediction of Solder Joints under Impact Conditions

Failure predictive modeling based on cohesive constitutive relation is used to study the effect of solder-joint array geometry on the integrity of live solder joints. The dynamic overstress state and crack propagation of the interface between the solder and the pad results in complete interface separation. This failure mode is predominant under impact conditions and is captured accurately by a numerical model. Package-level drop tests were simulated and experimentally validated by a 4-point dynamic bend system.