Mathematical Model of Coupling Capacitances in Two Layer Hybrid Structures

An application of Fourier integral method for determination of parasitic capacities in parallel conducting path systems is presented. It is a continuation of earlier investigations, which concerned the identification problems of capacitive couplings in hybrid microcircuits. In the general case two conductive paths are located on the dielectric microcircuit substrate of finite thickness. The submitted method is based on the solution of three-dimensional boundary problem. Electrical potential is presented here in the form of Fourier integrals, fulfilling the Laplace's equation. As the result the equation system for the distribution of electrical charges is obtained. The numerical solution method of this equation system has been applied. On this basis the capacity between conducting paths has been calculated and experimentally verified.