Precise Measurement of the Wafer Circuit Width Using Computer Vision

A method of measuring the two-dimension and nanowidth of wafer with fast speed and high precision level of sub-pixel width is offered in this paper. This method takes two steps: Firstly, utilizing the standard ruler to fast measure the pending size with per-pixel level of precision; secondly, utilizing the technology of spatial moment pixel subdivision to precisely locate the edge pixels of pending graph, achieving subpixel level of precision. We apply this method to measure and validate one welding-plate among the wafers. The result indicates that the measuring precision has been improved significantly and it can satisfy the requirement of the wafer's CD measurement and calibration