Design and performance of integrated antennas for wireless intra chip interconnections

Intra chip wireless interconnections using integrated antennas and microwaves travelling near the speed of light are being investigated to determine if these could alleviate the global interconnect limitations. Firstly theoretical investigations aboard the surface wave phenomenon. Then dipoles antennas of 1.98 mm length are integrated on silicon or SOI (silicon on insulator) substrates in a 130 nm CMOS technology. Their operation is demonstrated in frequencies around 27 GHz. Sufficient power transmission is measured between the antennas and high propagation speed improving the feasibility of the wireless interconnect system proposed here